By Cyrille Lothaire. Electrical Wiring. Publised at Thursday, December 28th 2017, 05:00:05 AM. Sensirion provides detailed information on both the package outline and the land pattern. In fact, it is recommended, because the IC pad pitch is just 0.5 mm, that only one solder mask opening should be used for all four pads on one side. It is also suggested, when using solder paste printing, that a laser-cut stainless steel stencil with trapezoidal walls and with a stencil thickness of 0.1 or 0.125 mm should be used. See the images below. This information should be quite helpful for a PCB layout design team.
By Dorian Yannic. Electrical Wiring. Published at Saturday, September 02nd 2017, 03:47:50 AM. You can also see that I’ve made it very easy for heat to move away from the regulator (U1) and into the ambient environment or into other portions of the PCB. U1’s thermal tab is connected to a large copper pour, and this copper pour is shot through with vias that conduct heat down to the internal ground plane. If I were really worried about thermal issues I could also connect these vias to a copper pour on the bottom side of the board, but in this case, it would have been total overkill.
By Olivier Constance. Electrical Wiring. Published at Thursday, August 31st 2017, 15:24:12 PM. Reset pin may be used to generate a system reset of the IC. And while a reset may also be externally generated by issuing a command (referred to as a soft reset), to achieve a full reset it is recommended to use the nReset pin (or of course you can also cycle power). On the other hand, if this pin is not to be used then it is recommended that it is either left floating or tied to VDD via a series resistor of value ≥2 kΩ.
By Fleurette Nina. Car Wiring. Published at Wednesday, August 30th 2017, 14:23:30 PM. The damage caused by overheated wires is easy to find; but if only a single wire has overheated and melted at some point, you may have to use a circuit tester to find the break. If the damage is in an open run of wiring, you may be able to mend separate wires without taking out a section of the loom. If it is in any part of the covered sections, you need to remove at least part of the wiring loom.
By France Barbara. Electrical Wiring. Published at Sunday, August 27th 2017, 10:48:35 AM. However, the SMT components and the traces must be at least 3.00 mm from the perforation holes. This prevents the damage to the PCB or components which can occur due to surface stress and splinter when separating the boards. One drawback with this method is that it may leave some unwanted board protrusions on the edges.
By Olivier Constance. Electrical Wiring. Published at Thursday, August 24th 2017, 10:28:02 AM. Manufacturers can use fixtures or panels to secure or frame fragile, thin, or oddly shaped PCBs. This allows them to easily fit the boards in the standard assembly, reflow, or automatic inspection machines. In addition to handling the irregular boards, the technologies enable the simultaneous processing of multiple boards as opposed to working on each board individually, hence reducing the production time and costs.
By Fleurette Nina. Electrical Wiring. Published at Saturday, August 19th 2017, 09:12:34 AM. The datasheet goes on to say that "the nRESET pin is internally connected to VDD with a pull up resistor of 50 kΩ." So... why are there two options for how to configure the nReset pin when it is not being used? Why not just recommend that it should be left floating (since it is already pulled high internally)? And, if there are indeed technical reasons for when the pin should be externally pulled up to VDD (for better noise immunity, as an example) then let us know what those technical reasons are.
By Dorian Yannic. Electrical Wiring. Published at Wednesday, August 16th 2017, 08:13:28 AM. I always prefer to maintain a logical flow of signals and functionality in my PCB layouts. I think that this approach results in an easier design process and a better board. The AWG layout progresses from left to right: from power input and communication input/output, to the power supply circuitry, to the processor, to the DAC (which is controlled by the processor and constitutes the board’s transition from digital to analog), to the analog signal-conditioning circuitry, and finally to the output connector. Parts that don’t have a specific position in the functional flow—such as the oscillator (U4), the DAC’s passives (C16, R5, etc.), and the voltage reference (U3)—are arranged near the components that they support.
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