Automatic machines translate to added costs and some such as the depaneling router creates vibrations, noise, and vast amounts of dust. In addition, you need to hold the board firmly. Although laser cutting is precise and has less mechanical stress, it is capital intensive and only applicable to board thicknesses of around 1 mm.
However, and this is very perplexing, there is no additional information related to the "separate application note." My suspicion is that Sensirion intended to include a link to this app note but then simply forgot to include it; perhaps additional information will be provided in the datasheet next revision.
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