Sensirion provides detailed information on both the package outline and the land pattern. In fact, it is recommended, because the IC pad pitch is just 0.5 mm, that only one solder mask opening should be used for all four pads on one side. It is also suggested, when using solder paste printing, that a laser-cut stainless steel stencil with trapezoidal walls and with a stencil thickness of 0.1 or 0.125 mm should be used. See the images below. This information should be quite helpful for a PCB layout design team.
When implementing a real-time system, we find a circular buffer critical whether we are using a DSP processor or a general purpose processor (GPP). However, with a GPP we may have to implement the circular buffer in software. As discussed in the previous section, with each new sample, we have to update the pointer which contains the address of the newest sample. With a circular buffer implemented in software, the programmer needs to take care of updating the buffer pointers after each read and write operation. When the pointer reaches the end of the buffer, the program must wrap the pointer back to the beginning of the buffer.
Nolanwebdev - Wiring Diagram Images Collection
Copyright © 2003 - 2018 Domain Media. All sponsored products, company names, brand names, trademarks and logos arethe property of their respective owners.