However, and this is very perplexing, there is no additional information related to the "separate application note." My suspicion is that Sensirion intended to include a link to this app note but then simply forgot to include it; perhaps additional information will be provided in the datasheet next revision.
Sensirion provides detailed information on both the package outline and the land pattern. In fact, it is recommended, because the IC pad pitch is just 0.5 mm, that only one solder mask opening should be used for all four pads on one side. It is also suggested, when using solder paste printing, that a laser-cut stainless steel stencil with trapezoidal walls and with a stencil thickness of 0.1 or 0.125 mm should be used. See the images below. This information should be quite helpful for a PCB layout design team.
Nolanwebdev - Wiring Diagram Images Collection
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