However, the SMT components and the traces must be at least 3.00 mm from the perforation holes. This prevents the damage to the PCB or components which can occur due to surface stress and splinter when separating the boards. One drawback with this method is that it may leave some unwanted board protrusions on the edges.
The fixtures are usually available in a variety of designs, materials, sizes, and thicknesses. Some can carry more than one board hence allowing the processing of multiple PCBs simultaneously. Other designs have adjustments to support both the primary and secondary side processes.
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