Sensirion provides detailed information on both the package outline and the land pattern. In fact, it is recommended, because the IC pad pitch is just 0.5 mm, that only one solder mask opening should be used for all four pads on one side. It is also suggested, when using solder paste printing, that a laser-cut stainless steel stencil with trapezoidal walls and with a stencil thickness of 0.1 or 0.125 mm should be used. See the images below. This information should be quite helpful for a PCB layout design team.
I always prefer to maintain a logical flow of signals and functionality in my PCB layouts. I think that this approach results in an easier design process and a better board. The AWG layout progresses from left to right: from power input and communication input/output, to the power supply circuitry, to the processor, to the DAC (which is controlled by the processor and constitutes the board’s transition from digital to analog), to the analog signal-conditioning circuitry, and finally to the output connector. Parts that don’t have a specific position in the functional flow—such as the oscillator (U4), the DAC’s passives (C16, R5, etc.), and the voltage reference (U3)—are arranged near the components that they support.
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