The decoupling capacitors (C4, C5, C6, C7, C9, C10, C11) are arranged around the perimeter of the chip, very close to their respective power pins and to the vias that connect the caps to the internal planes. Notice how the smaller cap is always closer to the power pin; this is because we rely more on the lower-value capacitor for high-frequency bypassing, and thus the first priority is minimizing the inductance and resistance between the smaller cap and the pin.
Generally, the fixture materials, which range from synthetic plastics and stones to aluminum alloys and epoxy glass, should be electrostatic neutral, and able to withstand repeated thermal cycles and chemicals without deforming or wear. In particular, the thin fixtures provide better thermal management.
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