V-groove panelization involves cutting a third of the board’s thickness from the top and bottom sides. The remaining part joins the separate boards and is then cut with a machine during the depaneling. This helps to reduce the stress on the PCB. One challenge with the V-groove method is that it is restrictive and cannot be used with PCBs that have overhanging components over the edges.
However, and this is very perplexing, there is no additional information related to the "separate application note." My suspicion is that Sensirion intended to include a link to this app note but then simply forgot to include it; perhaps additional information will be provided in the datasheet next revision.
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