Sensirion provides detailed information on both the package outline and the land pattern. In fact, it is recommended, because the IC pad pitch is just 0.5 mm, that only one solder mask opening should be used for all four pads on one side. It is also suggested, when using solder paste printing, that a laser-cut stainless steel stencil with trapezoidal walls and with a stencil thickness of 0.1 or 0.125 mm should be used. See the images below. This information should be quite helpful for a PCB layout design team.
Manual removal of the tabs depends on the design and thickness of the board. Extra care is required since using some tools such as the hook-shaped blade to break the solid tabs between the boards can be challenging and inefficient. For example, if the blade rotates within the small clearance between the boards, it can easily take a bite out of the useful part of the PCB. Also, taping the blade-cutting edge leaves a small part of the tab protruding from the board.
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