Depanelization is the process of separating the individual boards from the main array and usually depends on the panelization method applied. The choice depends on the clearance to provide at the edges of the PCB, and the presence of sensitive SMT devices, or hanging connectors near the edges. There are automatic methods, such as the laser cutting or depaneling router, as well as manual methods that involve breaking the tabs using hands or other tools.
Sensirion provides detailed information on both the package outline and the land pattern. In fact, it is recommended, because the IC pad pitch is just 0.5 mm, that only one solder mask opening should be used for all four pads on one side. It is also suggested, when using solder paste printing, that a laser-cut stainless steel stencil with trapezoidal walls and with a stencil thickness of 0.1 or 0.125 mm should be used. See the images below. This information should be quite helpful for a PCB layout design team.
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