PCBs with SMT on both sides and those with mixed TH and SMTs may start to flex and bow when in the reflow oven or selective soldering machine. For this reason, the maximum size for this type of board is usually smaller than the single-sided. Breaking out the boards manually can stress the board and components near the edges, the solder joints, or leave out rough stubs on the edges
The datasheet goes on to say that "the nRESET pin is internally connected to VDD with a pull up resistor of 50 kΩ." So... why are there two options for how to configure the nReset pin when it is not being used? Why not just recommend that it should be left floating (since it is already pulled high internally)? And, if there are indeed technical reasons for when the pin should be externally pulled up to VDD (for better noise immunity, as an example) then let us know what those technical reasons are.
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