However, the SMT components and the traces must be at least 3.00 mm from the perforation holes. This prevents the damage to the PCB or components which can occur due to surface stress and splinter when separating the boards. One drawback with this method is that it may leave some unwanted board protrusions on the edges.
This PCB, like almost all of my PCBs, is a four-layer board. In my opinion, it is not wise to restrict yourself to two layers unless you’re dealing with a very simple circuit or you really need to cut costs. The four-layer arrangement is beneficial in terms of routing and performance: routing, because via connections to internal planes almost completely eliminate power and ground traces; and performance, because the internal planes allow for low-resistance, low-inductance power and ground connections. The extra top-layer and bottom-layer real estate opened up by all the internal-plane connections come in very handy when you need to provide a generous copper area for improved thermal performance (for example, to make sure that your LDO or your motor driver doesn’t overheat and enter thermal shutdown).
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