Processing irregular and fragile PCBs in standard assembly machines is often a challenge. Due to their non-standard dimensions, the oddly shaped, thin, or fragile boards do not fit properly in the reflow, component placement, or other standard processing machines. Lack of adequate support and alignment may strain, bend or damage the fragile boards as they go through the processing system. In addition, this may impact the accuracy of the process.
The decoupling capacitors (C4, C5, C6, C7, C9, C10, C11) are arranged around the perimeter of the chip, very close to their respective power pins and to the vias that connect the caps to the internal planes. Notice how the smaller cap is always closer to the power pin; this is because we rely more on the lower-value capacitor for high-frequency bypassing, and thus the first priority is minimizing the inductance and resistance between the smaller cap and the pin.
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