Manufacturers can use fixtures or panels to secure or frame fragile, thin, or oddly shaped PCBs. This allows them to easily fit the boards in the standard assembly, reflow, or automatic inspection machines. In addition to handling the irregular boards, the technologies enable the simultaneous processing of multiple boards as opposed to working on each board individually, hence reducing the production time and costs.
The decoupling capacitors (C4, C5, C6, C7, C9, C10, C11) are arranged around the perimeter of the chip, very close to their respective power pins and to the vias that connect the caps to the internal planes. Notice how the smaller cap is always closer to the power pin; this is because we rely more on the lower-value capacitor for high-frequency bypassing, and thus the first priority is minimizing the inductance and resistance between the smaller cap and the pin.
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