Sensirion provides detailed information on both the package outline and the land pattern. In fact, it is recommended, because the IC pad pitch is just 0.5 mm, that only one solder mask opening should be used for all four pads on one side. It is also suggested, when using solder paste printing, that a laser-cut stainless steel stencil with trapezoidal walls and with a stencil thickness of 0.1 or 0.125 mm should be used. See the images below. This information should be quite helpful for a PCB layout design team.
The datasheet states (see image below) that this IC—specifically the CMOSens® technology that it uses—is "designed for mass production." Umm, should not this go without saying? I have seen datasheets state "not recommended for new designs," but I do not ever recall seeing one that specifies that the IC, or its underlying technology, is designed for mass production. This benefit makes me question if Sensirion has other ICs that are in fact not designed for mass production. It is all a bit puzzling. Have you seen other IC datasheets call this out? If so, please let us know.
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