However, the SMT components and the traces must be at least 3.00 mm from the perforation holes. This prevents the damage to the PCB or components which can occur due to surface stress and splinter when separating the boards. One drawback with this method is that it may leave some unwanted board protrusions on the edges.
To overcome these challenges, engineers may use SMT fixtures or the panelization techniques. Each of the two methods provides a carrier with standard dimensions and provisions for fitting, securing and supporting the irregular boards.
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