The decoupling capacitors (C4, C5, C6, C7, C9, C10, C11) are arranged around the perimeter of the chip, very close to their respective power pins and to the vias that connect the caps to the internal planes. Notice how the smaller cap is always closer to the power pin; this is because we rely more on the lower-value capacitor for high-frequency bypassing, and thus the first priority is minimizing the inductance and resistance between the smaller cap and the pin.
The datasheet states (see image below) that this IC—specifically the CMOSens® technology that it uses—is "designed for mass production." Umm, should not this go without saying? I have seen datasheets state "not recommended for new designs," but I do not ever recall seeing one that specifies that the IC, or its underlying technology, is designed for mass production. This benefit makes me question if Sensirion has other ICs that are in fact not designed for mass production. It is all a bit puzzling. Have you seen other IC datasheets call this out? If so, please let us know.
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