Sensirion provides detailed information on both the package outline and the land pattern. In fact, it is recommended, because the IC pad pitch is just 0.5 mm, that only one solder mask opening should be used for all four pads on one side. It is also suggested, when using solder paste printing, that a laser-cut stainless steel stencil with trapezoidal walls and with a stencil thickness of 0.1 or 0.125 mm should be used. See the images below. This information should be quite helpful for a PCB layout design team.
The datasheet goes on to say that "the nRESET pin is internally connected to VDD with a pull up resistor of 50 kΩ." So... why are there two options for how to configure the nReset pin when it is not being used? Why not just recommend that it should be left floating (since it is already pulled high internally)? And, if there are indeed technical reasons for when the pin should be externally pulled up to VDD (for better noise immunity, as an example) then let us know what those technical reasons are.
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