Care should be taken when depaneling the perforated-tab PCB array; otherwise, an incorrect method will splinter or tear the solder-mask or active surface layer. The ideal breakout method should not cause any damage to the board or transfer stress from the PCB surface to the components.
The fixtures are usually available in a variety of designs, materials, sizes, and thicknesses. Some can carry more than one board hence allowing the processing of multiple PCBs simultaneously. Other designs have adjustments to support both the primary and secondary side processes.
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