Depanelization is the process of separating the individual boards from the main array and usually depends on the panelization method applied. The choice depends on the clearance to provide at the edges of the PCB, and the presence of sensitive SMT devices, or hanging connectors near the edges. There are automatic methods, such as the laser cutting or depaneling router, as well as manual methods that involve breaking the tabs using hands or other tools.
Typical fixtures have high-temperature resistance, good mechanical strength for precision machining, and good abrasion and chemical resistance to withstand the pallet cleaners and soluble fluxes.
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