The fixtures are usually available in a variety of designs, materials, sizes, and thicknesses. Some can carry more than one board hence allowing the processing of multiple PCBs simultaneously. Other designs have adjustments to support both the primary and secondary side processes.
Depanelization is the process of separating the individual boards from the main array and usually depends on the panelization method applied. The choice depends on the clearance to provide at the edges of the PCB, and the presence of sensitive SMT devices, or hanging connectors near the edges. There are automatic methods, such as the laser cutting or depaneling router, as well as manual methods that involve breaking the tabs using hands or other tools.
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