There are different panelization and de-panelization methods depending on the application of the PCB, thickness, shape, component layout, type of edges, and other factors. The two popular methods are the V-groove panelization and the breakaway tab panelization. Each of these uses a different method to separate the boards from the main array and has its advantages and limitations.
Automatic machines translate to added costs and some such as the depaneling router creates vibrations, noise, and vast amounts of dust. In addition, you need to hold the board firmly. Although laser cutting is precise and has less mechanical stress, it is capital intensive and only applicable to board thicknesses of around 1 mm.
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