There are different panelization and de-panelization methods depending on the application of the PCB, thickness, shape, component layout, type of edges, and other factors. The two popular methods are the V-groove panelization and the breakaway tab panelization. Each of these uses a different method to separate the boards from the main array and has its advantages and limitations.
The decoupling capacitors (C4, C5, C6, C7, C9, C10, C11) are arranged around the perimeter of the chip, very close to their respective power pins and to the vias that connect the caps to the internal planes. Notice how the smaller cap is always closer to the power pin; this is because we rely more on the lower-value capacitor for high-frequency bypassing, and thus the first priority is minimizing the inductance and resistance between the smaller cap and the pin.
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