PCBs with SMT on both sides and those with mixed TH and SMTs may start to flex and bow when in the reflow oven or selective soldering machine. For this reason, the maximum size for this type of board is usually smaller than the single-sided. Breaking out the boards manually can stress the board and components near the edges, the solder joints, or leave out rough stubs on the edges
The decoupling capacitors (C4, C5, C6, C7, C9, C10, C11) are arranged around the perimeter of the chip, very close to their respective power pins and to the vias that connect the caps to the internal planes. Notice how the smaller cap is always closer to the power pin; this is because we rely more on the lower-value capacitor for high-frequency bypassing, and thus the first priority is minimizing the inductance and resistance between the smaller cap and the pin.
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