V-groove panelization involves cutting a third of the board’s thickness from the top and bottom sides. The remaining part joins the separate boards and is then cut with a machine during the depaneling. This helps to reduce the stress on the PCB. One challenge with the V-groove method is that it is restrictive and cannot be used with PCBs that have overhanging components over the edges.
The datasheet states (see image below) that this IC—specifically the CMOSens® technology that it uses—is "designed for mass production." Umm, should not this go without saying? I have seen datasheets state "not recommended for new designs," but I do not ever recall seeing one that specifies that the IC, or its underlying technology, is designed for mass production. This benefit makes me question if Sensirion has other ICs that are in fact not designed for mass production. It is all a bit puzzling. Have you seen other IC datasheets call this out? If so, please let us know.
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