Sensirion provides detailed information on both the package outline and the land pattern. In fact, it is recommended, because the IC pad pitch is just 0.5 mm, that only one solder mask opening should be used for all four pads on one side. It is also suggested, when using solder paste printing, that a laser-cut stainless steel stencil with trapezoidal walls and with a stencil thickness of 0.1 or 0.125 mm should be used. See the images below. This information should be quite helpful for a PCB layout design team.
This IC is available only in an 8-pin dual-flat no-leads (DFN) package, measuring a scant 2.5mm × 2.5mm with a tiny thickness of only 0.9mm. There is also, in addition to the eight pins, a thermal pad that is connected to ground (see image below).
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