Care should be taken when depaneling the perforated-tab PCB array; otherwise, an incorrect method will splinter or tear the solder-mask or active surface layer. The ideal breakout method should not cause any damage to the board or transfer stress from the PCB surface to the components.
This IC is available only in an 8-pin dual-flat no-leads (DFN) package, measuring a scant 2.5mm × 2.5mm with a tiny thickness of only 0.9mm. There is also, in addition to the eight pins, a thermal pad that is connected to ground (see image below).
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