This IC is available only in an 8-pin dual-flat no-leads (DFN) package, measuring a scant 2.5mm × 2.5mm with a tiny thickness of only 0.9mm. There is also, in addition to the eight pins, a thermal pad that is connected to ground (see image below).
Automatic machines translate to added costs and some such as the depaneling router creates vibrations, noise, and vast amounts of dust. In addition, you need to hold the board firmly. Although laser cutting is precise and has less mechanical stress, it is capital intensive and only applicable to board thicknesses of around 1 mm.
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