You can also see that I’ve made it very easy for heat to move away from the regulator (U1) and into the ambient environment or into other portions of the PCB. U1’s thermal tab is connected to a large copper pour, and this copper pour is shot through with vias that conduct heat down to the internal ground plane. If I were really worried about thermal issues I could also connect these vias to a copper pour on the bottom side of the board, but in this case, it would have been total overkill.
Processing irregular and fragile PCBs in standard assembly machines is often a challenge. Due to their non-standard dimensions, the oddly shaped, thin, or fragile boards do not fit properly in the reflow, component placement, or other standard processing machines. Lack of adequate support and alignment may strain, bend or damage the fragile boards as they go through the processing system. In addition, this may impact the accuracy of the process.
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