Sensirion provides detailed information on both the package outline and the land pattern. In fact, it is recommended, because the IC pad pitch is just 0.5 mm, that only one solder mask opening should be used for all four pads on one side. It is also suggested, when using solder paste printing, that a laser-cut stainless steel stencil with trapezoidal walls and with a stencil thickness of 0.1 or 0.125 mm should be used. See the images below. This information should be quite helpful for a PCB layout design team.
Generally, the fixture materials, which range from synthetic plastics and stones to aluminum alloys and epoxy glass, should be electrostatic neutral, and able to withstand repeated thermal cycles and chemicals without deforming or wear. In particular, the thin fixtures provide better thermal management.
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