Care should be taken when depaneling the perforated-tab PCB array; otherwise, an incorrect method will splinter or tear the solder-mask or active surface layer. The ideal breakout method should not cause any damage to the board or transfer stress from the PCB surface to the components.
Automatic machines translate to added costs and some such as the depaneling router creates vibrations, noise, and vast amounts of dust. In addition, you need to hold the board firmly. Although laser cutting is precise and has less mechanical stress, it is capital intensive and only applicable to board thicknesses of around 1 mm.
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