The decoupling capacitors (C4, C5, C6, C7, C9, C10, C11) are arranged around the perimeter of the chip, very close to their respective power pins and to the vias that connect the caps to the internal planes. Notice how the smaller cap is always closer to the power pin; this is because we rely more on the lower-value capacitor for high-frequency bypassing, and thus the first priority is minimizing the inductance and resistance between the smaller cap and the pin.
The fixture should support the board and prevent distortion as the board goes through the printing, component placement, and reflow processes. Its construction should ensure adequate protection for the bottom side components during the double-sided reflow process.
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