This IC is available only in an 8-pin dual-flat no-leads (DFN) package, measuring a scant 2.5mm × 2.5mm with a tiny thickness of only 0.9mm. There is also, in addition to the eight pins, a thermal pad that is connected to ground (see image below).
To overcome these challenges, engineers may use SMT fixtures or the panelization techniques. Each of the two methods provides a carrier with standard dimensions and provisions for fitting, securing and supporting the irregular boards.
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