However, the SMT components and the traces must be at least 3.00 mm from the perforation holes. This prevents the damage to the PCB or components which can occur due to surface stress and splinter when separating the boards. One drawback with this method is that it may leave some unwanted board protrusions on the edges.
Automatic machines translate to added costs and some such as the depaneling router creates vibrations, noise, and vast amounts of dust. In addition, you need to hold the board firmly. Although laser cutting is precise and has less mechanical stress, it is capital intensive and only applicable to board thicknesses of around 1 mm.
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