As you may have noticed, this is one of those annoying situations in which the pin configuration is the opposite of what you want: the DAC’s input pins move from bit 7 to bit 0 going downward, whereas the MCU’s output pins move from bit 7 to bit 0 going upward. I couldn’t remedy this by re-assigning the microcontroller pins because I wanted the data bits to correspond to the actual bits of the Port 2 register (so that I could write a full byte to the DAC without moving bits around). So I ended up with some awkward routing, but nothing terrible.
Sensirion provides detailed information on both the package outline and the land pattern. In fact, it is recommended, because the IC pad pitch is just 0.5 mm, that only one solder mask opening should be used for all four pads on one side. It is also suggested, when using solder paste printing, that a laser-cut stainless steel stencil with trapezoidal walls and with a stencil thickness of 0.1 or 0.125 mm should be used. See the images below. This information should be quite helpful for a PCB layout design team.
Nolanwebdev - Wiring Diagram Images Collection
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