This IC is available only in an 8-pin dual-flat no-leads (DFN) package, measuring a scant 2.5mm × 2.5mm with a tiny thickness of only 0.9mm. There is also, in addition to the eight pins, a thermal pad that is connected to ground (see image below).
Processing irregular and fragile PCBs in standard assembly machines is often a challenge. Due to their non-standard dimensions, the oddly shaped, thin, or fragile boards do not fit properly in the reflow, component placement, or other standard processing machines. Lack of adequate support and alignment may strain, bend or damage the fragile boards as they go through the processing system. In addition, this may impact the accuracy of the process.
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