There are different panelization and de-panelization methods depending on the application of the PCB, thickness, shape, component layout, type of edges, and other factors. The two popular methods are the V-groove panelization and the breakaway tab panelization. Each of these uses a different method to separate the boards from the main array and has its advantages and limitations.
Care should be taken when depaneling the perforated-tab PCB array; otherwise, an incorrect method will splinter or tear the solder-mask or active surface layer. The ideal breakout method should not cause any damage to the board or transfer stress from the PCB surface to the components.
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