However, the SMT components and the traces must be at least 3.00 mm from the perforation holes. This prevents the damage to the PCB or components which can occur due to surface stress and splinter when separating the boards. One drawback with this method is that it may leave some unwanted board protrusions on the edges.
V-groove panelization involves cutting a third of the board’s thickness from the top and bottom sides. The remaining part joins the separate boards and is then cut with a machine during the depaneling. This helps to reduce the stress on the PCB. One challenge with the V-groove method is that it is restrictive and cannot be used with PCBs that have overhanging components over the edges.
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