Manual removal of the tabs depends on the design and thickness of the board. Extra care is required since using some tools such as the hook-shaped blade to break the solid tabs between the boards can be challenging and inefficient. For example, if the blade rotates within the small clearance between the boards, it can easily take a bite out of the useful part of the PCB. Also, taping the blade-cutting edge leaves a small part of the tab protruding from the board.
The datasheet states (see image below) that this IC—specifically the CMOSens® technology that it uses—is "designed for mass production." Umm, should not this go without saying? I have seen datasheets state "not recommended for new designs," but I do not ever recall seeing one that specifies that the IC, or its underlying technology, is designed for mass production. This benefit makes me question if Sensirion has other ICs that are in fact not designed for mass production. It is all a bit puzzling. Have you seen other IC datasheets call this out? If so, please let us know.
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