You can also see that I’ve made it very easy for heat to move away from the regulator (U1) and into the ambient environment or into other portions of the PCB. U1’s thermal tab is connected to a large copper pour, and this copper pour is shot through with vias that conduct heat down to the internal ground plane. If I were really worried about thermal issues I could also connect these vias to a copper pour on the bottom side of the board, but in this case, it would have been total overkill.
The datasheet states (see image below) that this IC—specifically the CMOSens® technology that it uses—is "designed for mass production." Umm, should not this go without saying? I have seen datasheets state "not recommended for new designs," but I do not ever recall seeing one that specifies that the IC, or its underlying technology, is designed for mass production. This benefit makes me question if Sensirion has other ICs that are in fact not designed for mass production. It is all a bit puzzling. Have you seen other IC datasheets call this out? If so, please let us know.
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