Processing irregular and fragile PCBs in standard assembly machines is often a challenge. Due to their non-standard dimensions, the oddly shaped, thin, or fragile boards do not fit properly in the reflow, component placement, or other standard processing machines. Lack of adequate support and alignment may strain, bend or damage the fragile boards as they go through the processing system. In addition, this may impact the accuracy of the process.
Automatic machines translate to added costs and some such as the depaneling router creates vibrations, noise, and vast amounts of dust. In addition, you need to hold the board firmly. Although laser cutting is precise and has less mechanical stress, it is capital intensive and only applicable to board thicknesses of around 1 mm.
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